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- W565568476 abstract "Ti-Al-N films were deposited using an activated reactive evaporation (ARE) method with single vapor source of Ti-Al alloys. The behavior of some species excited and ionized in the plasma and a relationship between these reacting species and important operating parameters of ARE such as a probe voltage were investigated by optical emission spectroscopy(OES) and mass spectrometry(MS). The films were characterized by XRD, EPMA and AES. A high temperature oxidation of Ti-Al-N films were studied in air at temperatures from 600 to 1000°C. The results were summarized as follows.(1) Each of emission lines from titanium, aluminum and nitrogen by OES could be detected without interferences.(2) Since TiN+ was observed by MS during TiN and Ti-Al-N film formation, TiN was considered to be synthesized in the plasma.(3) The Ti/Al ratios of Ti-Al-N films analyzed by EPMA showed a good correlation to the Ti/Al ratios monitored by OES and MS respectively.(4) The resistivity to oxidation of Ti-Al-N films increased with increasing Al content in the films." @default.
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- W565568476 date "1998-01-01" @default.
- W565568476 modified "2023-09-26" @default.
- W565568476 title "Formation of Ti-Al-N Films by an Activated Reactive Evaporation (ARE) Method" @default.
- W565568476 doi "https://doi.org/10.2320/jinstmet1952.62.1_98" @default.
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