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- W565573703 abstract "Coupling an optical chip to its surroundings is very hard compared to an electrical chip. This complexity is mainly caused by alignment and accuracy challenges and is driving the cost price up to levels at which the commercial benefits of optical chips are no longer obvious, despite their many great technological advantages. Up to 80% of an optical system’s cost price consists of packaging, in which the coupling of chip to fiber is done on chip level instead of per wafer. We investigate reducing these packaging costs to make optical chips commercially more attractive." @default.
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- W565573703 date "2010-01-01" @default.
- W565573703 modified "2023-09-27" @default.
- W565573703 title "Low-cost packaging concepts for integrated nanophotonics" @default.
- W565573703 hasPublicationYear "2010" @default.
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