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- W566989905 abstract "A novel bondline architecture for bonded composite joints is presented. By implementing a distinct rather ductile thermoplastic phase, a physical barrier for growing disbonds is obtained and thus a more fail-safe design, respectively. Furthermore, the joint is established by usingtwo different joining technologies, namely adhesive bonding and thermoset composite welding.A possible manufacturing technique is briefly described and assessed by means of Double Cantilever Beam (DCB) and Single Lap Shear (SLS) tests. The thermoplastic phase constrains disbonds by posing a physical barrier through a discrete change of materials. Thus, a significant increase against crack propagation is observed for DCB tests. However, visual examinations of the transition zone between both adhesive materials disclose sensitivity to a thickness mismatch between both materials leading to adhesion deficiencies in the vicinity of the thermoplast." @default.
- W566989905 created "2016-06-24" @default.
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- W566989905 date "2014-06-01" @default.
- W566989905 modified "2023-09-27" @default.
- W566989905 title "Experimental Investigations of the Disbond Stopping Capability of a Novel Epoxy-Thermoplastic Bondline Architecture for Composite Joints" @default.
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