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- W570099365 abstract "Part I. Low-k Materials: 1. Ultra low-k materials based on self-assembled organic polymers Marianna Pantouvaki 2. New designs of hydrophobic and mesostructured ultra low k materials with isolated mesopores Anthony Grunenwald 3. Evaluation of ultra-thin layer fabricated by wet-process as a pore-seal for porous low-k films Shoko Ono 4. Ozone treatment on nanoporous ultralow dielectric materials to optimize their mechanical and dielectrical properties Hee-Woo Rhee Part II. Integration: 5. Optimizing stressor film deposition sequence in polish rate order for best planarization John H. Zhang 6. Effect of chemical solutions and surface wettability on the stability of advanced porous low-k materials Quoc Toan Le 7. A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices Sven Zimmermann 8. Defects in low-k insulators (k=2.5-2.0): ESR analysis and charge injection Valeri Afanas'ev 9. Patterning organic fluorescent molecules with SAM patterns Nan Lu 10. Optical interconnect technologies based on silicon photonics Wim Bogaerts Part III. Metallization: 11. 32nm node highly reliable Cu/low-k integration technology with CuMn alloy seed Shaoning Yao 12. Amorphous Ta-N as a diffusion barrier for Cu metallization Neda Dalili 13. Comparison of TiN thin films grown on SiO2 by reactive dc magnetron sputtering and high power impulse magnetron sputtering Jon Gudmundsson 14. Specific contact resistance of ohmic contacts on n-type SiC membranes Patrick Leech 15. Development of electrochemical copper deposition screening methodologies for next generation additive selection Kevin Ryan Part IV. 3D Packaging: 16. Microbump impact on reliability and performance in through-silicon via stacks Aditya Karmarkar 17. Tailoring the crystallographic texture and electrical properties of inkjet-printed interconnects for use in microelectronics Romain Cauchois." @default.
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- W570099365 date "2012-01-01" @default.
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- W570099365 title "Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011 : symposium held April 25-29, 2011, San Francisco, California, U.S.A." @default.
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