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• W571879 abstract "This paper presents the development of an automatic visual inspection machines for inspecting the soldering points (called as Bump) in a Flip- Chip component which is an important part of a hard disk drive (HDD). Image feature extraction is used to measure the interesting features such as bump area, bump ratio, and etc. from the X-ray input image. Accuracy of the proposed measuring system is verified by comparing with the measured value from the destructive inspection. Genetic Algorithm are used to detect the edge of bump. Experimental results show that our proposed developed inspection machine is effectively used for bump inspection. and etc. In the past decades, many immense developments in automatic visual inspection machines have been done and the results of those are used extensively in today's industrial process inspection. To inspect the physical shape of the component in HDD, mostly, a high resolution camera is used as a video capture device and the inspection is carried out by human. In some cases, X-ray camera is used instead of CCD camera for inspecting the component. The effectiveness of such inspection is mainly depended on the skill of inspector. Unfortunately, there are many problems caused by human inspection such as the unskilled inspectors, human errors, time consuming, and etc. To overcome these problems, this research aims to study and provide solutions to the primary problems in visual inspection. In this paper, we developed an automatic visual inspection machine for inspecting bumps in a Flip-Chip component. The developed machine enhances the visual inspection system and solves the significant problems caused by human inspection. The accuracy of the proposed technique is investigated in comparison with the measured value from the destructive inspection. As shown in experimental results, the proposed machine has good accuracy for inspecting bumps in Flip-Chip. The remainder of this paper is organized as follows. Automatic visual inspection and proposed image processing is described in section 2. The experimental results are shown in section 3. And, finally, in section 4 the paper is summarized with some final remarks." @default.
• W571879 created "2016-06-24" @default.
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• W571879 date "2008-01-01" @default.
• W571879 modified "2023-09-27" @default.
• W571879 title "Automatic Visual Inspection of Bump in Flip Chip using Edge Detection with Genetic Algorithm" @default.
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