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- W573668654 abstract "This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage." @default.
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- W573668654 date "1995-01-01" @default.
- W573668654 modified "2023-09-28" @default.
- W573668654 title "Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A." @default.
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