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- W579255219 abstract "In this thesis work the manufacturing of through glass vias (TGVs) is presented.The TGVs were manufactured by adapting technique based on magnetic assemblydeveloped at KTH for creating through silicon vias (TSVs). TGVs were fabricatedby introducing nickel wires in via-holes that were pre-made on a glass substrateand applying a spin-on polymer to isolate the nickel wires from the walls of thevia-holes.Another focus of this work was improving the TGV and TSV manufacturingprocess. This was done by investigating the inuence of the assembly speeds onthe yield of the assembly process. Two methods for removing the excess wires lefton the surface of the wafer after the magnetic assembly of the nickel wires weretested. Also the inuence the pitch between the via-holes has on the yield of theprocess was investigated." @default.
- W579255219 created "2016-06-24" @default.
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- W579255219 date "2014-01-01" @default.
- W579255219 modified "2023-09-27" @default.
- W579255219 title "Development of Through Glass Vias (TGVs) for Interposer Applications" @default.
- W579255219 hasPublicationYear "2014" @default.
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