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- W585178487 abstract "Abstract The effects of temperature on Cu pad consumption and intermetallic compound (IMC) growth were investigated under current stressing. The Cu/Sn–3.0Ag–0.5Cu (SAC305)/Cu solder joints were used, with a certain current density of 0.76×10 4 A/cm 2 at 100, 140, 160 and 180 °C. The constitutive equations of cathode Cu pad consumption and anode interface IMC growth are established, respectively, based on the loading time and sample temperature. The cathode Cu pad consumption ( δ ) increases linearly with the loading time and the consumption rate shows parabolic curve relationships with sample temperature. The anode interface IMC thickness ( δ 1 ) increased is linearly with the square root of loading time and the interface IMC growth coefficient shows parabolic curve relationship with sample temperature. The δ and δ 1 have different variation laws under current stressing, due to the current facilitating larger amount of IMC formation in the bulk solder." @default.
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- W585178487 date "2015-05-01" @default.
- W585178487 modified "2023-10-18" @default.
- W585178487 title "Effect of temperature on interface diffusion in micro solder joint under current stressing" @default.
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- W585178487 doi "https://doi.org/10.1016/s1003-6326(15)63775-x" @default.
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