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- W598014722 abstract "The effects of the melt state on the microstructure of Sn–3.5%Ag solder were investigated at two different cooling rates. The results show the solid–liquid interface energy is found to increase when the alloy is melted at above liquid–liquid structure transition (L-LST) temperature. Consequently, the melts require a larger undercooling to nucleate and a slower rate to grow. Finally, the solidification microstructures of the Sn–3.5%Ag alloy are refined. During L-LST, the eutectic growth pattern changes from a metastable cellular eutectic growth into a rod-like regular eutectic in some grains. L-LST refines the microstructure, inevitably leading to increased microhardness. At different cooling rates, the effects of the melt state on the microstructure and microhardness of Sn–3.5%Ag solder are similar." @default.
- W598014722 created "2016-06-24" @default.
- W598014722 date "1956-12-01" @default.
- W598014722 modified "2023-10-18" @default.
- W598014722 title "Handbook of scientific and technical awards in the United States and Canada, 1900–1952" @default.
- W598014722 doi "https://doi.org/10.1016/0016-0032(56)90699-8" @default.
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