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- W60263113 abstract "Semiconductor processing temperatures are currently measured using either pyrometers or thermocouples, both of which have significant limitations. Temperature measurements based on the temperature dependance of the Lamb wave velocities in silicon and longitudinal waves through the ambient directly above the wafer are explored." @default.
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- W60263113 date "1990-01-01" @default.
- W60263113 modified "2023-09-25" @default.
- W60263113 title "Temperature Measurement of Silicon Wafers Using Photoacoustic Techniques" @default.
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- W60263113 doi "https://doi.org/10.1007/978-1-4684-5772-8_141" @default.
- W60263113 hasPublicationYear "1990" @default.
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