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- W626724094 abstract "Grain Boundary Diffusion and Oxidation Processes Influence of Grain Boundary Diffusion on Thin Film Reactions Motion of the Grain Boundary System with the Triple Junctions Study of Grain-Boundary Diffusion of Au in Copper within 5 Misorientation Range in the Context of Structure of Grain Boundaries Grain Boundary Diffusion in Polycrystalline Solids with an Arbitrary Grain Size Pseudo Type-B Diffusion Regime in Cu Grain Boundaries below 250 DegreesC Segregation and Grain Boundary Diffusion in Metals and Elemental Semi-Conductors Nonlinear Segregation Effects on Grain Boundary Heterodiffusion Extraction of Segregation Term from a Triple Product Solute Diffusion and Segregation in Grain Boundaries of Silver and Copper Grain Boundary Diffusion and Stability of the Triple Junctions A New Method for Grain Boundary Diffusion Coefficient Measurement Complex Atomic-Scale Dynamics in Grain Boundaries in Silicon Relation Between Segregation at Interfaces, Structure and Diffusion in Germanium Microscopic Investigation of Surface Segregation in Random Alloys Segregation, Phase Separation and Grain Boundary Diffusion in Thin Films AES Study of the Mass Transport of Nickel Near Ni / Cu (111) Interface Grain Boundary Segregation in the Cu-Bi System Grain Boundary Electromigration in Thin Films: Interface Reaction and Segregation Effects Grain Boundary Diffusion, Electromigration and Segregation in Cu and Cu-2wt% Sn Alloy The Effect of Pressure on Grain Boundary Wetting, Segregation and Diffusion Strain Induced Grain Boundary Premelting due to Heavy Pile-Up of Screw Dislocations in Deformed Copper Bicrystals Copper Diffusion in Nickel Thin Film under Stresses in the Kinetic Regime 'B' Influence of Precipitates on the Grain Boundary Diffusion: A Perturbative Approach The Manifestations of the Diffusion-Coefficient Distribution Functions of the Grain Boundaries in W and Au Polycrystals The Study of the Diffusion of 57Co in Polycrystalline Gold at the Upper Boundary of Temperature Interval Ordinarily Used in Intercrystallite Diffusion Investigations Low-Temperature Interdiffusion in Binary and Multilayer Thin Film System Exact Solution of Triple Junction Diffusion Problem Relaxation Processes in Ultrafine-Grained Copper Processed by Severe Plastic Deformation Growth and Healing of Voids at Grain Boundary during High Temperature Creep Mechanisms of Grain Boundary Diffusion in Intermetallic Compounds Grain Boundary Diffusion in Thin Films under Stress Field in Kinetic Regime 'C' Round Table Discussion I: Diffusion in Intermetallics Round Table Discussion II: Grain Boundary Wetting and Liquid Grooving" @default.
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- W626724094 date "1998-01-01" @default.
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- W626724094 title "Grain boundary diffusion and grain boundary segregation : proceedings of the International Workshop : DiBoS-97, held in Moscow, Russia, May 1997" @default.
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