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- W6577617 abstract "The cure processes of TGDDM-based epoxy thermosets and polysulfone thermoplastic resins were monitored by means of computer-controlled dynamic dielectric measurements made at frequencies 5 Hz to 5 million Hz. The values of capacitance and conductance were recorded, and the data were used to calculate the complex permittivity, an intensive property which is characteristic of the material's state of cure and independent of the amount of material measured. The frequency dependence of the complex permittivity value was used to determine the conductivity and mean relaxation time. The conductivity which is also an intensive variable and is independent of sample size, was correlated with the viscosity in both the epoxy and polysulfone systems." @default.
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- W6577617 date "1986-01-01" @default.
- W6577617 modified "2023-09-26" @default.
- W6577617 title "Dynamic dielectric analysis - A nondestructive cure process monitoring method" @default.
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