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- W658252811 abstract "PrefaceChapter 1: Introduction to Electronic PackagingChapter 2: Trends/Drivers in the Electronics Manufacturing IndustryChapter 3: Area Array PackagingChapter 4: Stacked/3D PackagesChapter 5: Compliant IC PackagingChapter 6: Flip Chip TechnologyChapter 7: Options in High-Density Part CleaningChapter 8: MEMS Packaging and Assembly ChallengesChapter 9: Ceramic Ball and Column Grid Array OverviewINDEX" @default.
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- W658252811 date "2003-10-24" @default.
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- W658252811 title "Area Array Package Design: Techniques in High Density Electronics" @default.
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