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• W70206627 abstract "Publisher Summary This chapter concentrates on the properties and the processing of organic dielectric materials. Multilevel metal/dielectric interconnection technology strongly impacts chip size and performance, and plays an important part in chip cost, yield, and reliability. Therefore, several considerations are involved in changing from one wiring/dielectric scheme to another. The most common organic dielectrics used as multilevel metal dielectrics are materials that can withstand high processing temperatures, have low dielectric constants, and are easily integrated with semiconductor materials. The classes of materials that form organic dielectrics are known as polymers. Several leading candidates for organic dielectrics have emerged due to their combinations of superior processability, thermal stability, and dielectric properties. The most widely used class of materials is polyimides because for their chemistry and processing properties. Polyimides are a general class of compounds, which consist of a polyamic acid monomer. Upon polymerization, these compounds undergo condensation reactions to form the polyimide polymer chains. The performance advantages that organic dielectrics offer make them attractive in designing advanced semiconductor chips and packages. In order to take full advantage of these materials, a process must be designed, which fully integrates the metallization steps with the polymer. One of the main attractions of organic dielectrics is their low cost; in fact, polyimides are used in many cost-performance offerings. Photosensitive polyimides are particularly attractive, as several photoresist apply-and-remove steps may be eliminated." @default.
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• W70206627 date "2001-01-01" @default.
• W70206627 modified "2023-09-22" @default.
• W70206627 title "Organic Dielectrics in Multilevel Metallization of Integrated Circuits" @default.
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• W70206627 doi "https://doi.org/10.1016/b978-081551442-8.50018-3" @default.
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