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- W75056890 abstract "This paper discusses the impact of various metallurgical process and design parameters on the mechanical behavior and long‐term reliability of layered aluminum metallizations. The effects of alloying, dopant precipitation and intermetallic reaction layer formation on brittleness, strength, and toughness, are illustrated by stress‐temperature behavior and microstructural analyses. It is shown that designing for electromigration and stress‐migration robustness may become two separate objectives of interconnect development. Likewise, because of trade‐offs between brittleness and strength, as well as microstructural considerations, high mechanical strength may not lead to optimum narrow interconnect reliability." @default.
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- W75056890 date "1994-01-01" @default.
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- W75056890 title "Integrated process design effects on the mechanical behavior of layered interconnects" @default.
- W75056890 doi "https://doi.org/10.1063/1.45696" @default.
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