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W76152363 abstract "Due to an expanding consumer electronics market and the need for form factor reduction, stack packages have been gaining popularity in the last 3 years. The most efficient way to increase memory product’s capacity without increasing package size is to adopt die stacking package structure. Essentially, DRAM’s layout is different compared to other chip option – the bond pads are located on the chip centerline. Conventional die stacking structure might not be suitable for DRAM packaging application. This paper presents three innovative package designs for DRAM memory packages, with the option of die stacking: D2i/D2-wCSP, D2-FBGA and 2DD2-wCSP. This paper discusses the scope of development for these packages, comprising of upfront design considerations such as electrical performance, package structure design and reliability. Assembly process and development will also be discussed. Finally package reliability and board level reliability data are also provided in this paper." @default.
W76152363 created "2016-06-24" @default.
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W76152363 date "2005-01-01" @default.
W76152363 modified "2023-09-27" @default.
W76152363 title "Stacked Die Technology Solutions for wCSP Memor y Packages" @default.
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