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- W765960245 abstract "248nm pulses from a KrF excimer laser was used to ablate a Si wafer in order to ascertain the laser pulse and energy effects for use as a microstructuring tool for MEMS fabrication. The laser pulses were varied between two different energy levels of 8mJ and 4mJ while the number of pulses for ablation was varied. The corresponding ablated depths were found to range between 11 µm and 49 µm, depending on the demagnified beam fluence." @default.
- W765960245 created "2016-06-24" @default.
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- W765960245 date "2015-01-01" @default.
- W765960245 modified "2023-09-25" @default.
- W765960245 title "248nm silicon photoablation: Microstructuring basics" @default.
- W765960245 doi "https://doi.org/10.1063/1.4915841" @default.
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