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- W778535476 abstract "Ti／Ag／Cu活性焊料法广泛应用于陶瓷与金属的焊接中，但该焊料在陶瓷表面的浸润性较差，在金属表面易发生偏析的现象。本文对该焊料的流散特性进行了讨论，对陶瓷与金属的封接界面进行了分析，对封接机理进行了讨论，结果表明在封接界面生成Ti的氧化物主要是TiO2。" @default.
- W778535476 created "2016-06-24" @default.
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- W778535476 date "2006-01-01" @default.
- W778535476 modified "2023-09-24" @default.
- W778535476 title "Ti／Ag／Cu活性焊料的封接特性" @default.
- W778535476 hasPublicationYear "2006" @default.
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