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- W782786444 abstract "Cu(hfac) $_2$ ,(Cu(II) hexafluoroacetylacetonate)를 프리커서로 하는 구리 화학증착에 대해 자유에너지 최소화법으로 열역학적 평형조성 계산을 수행하였다. Cu(hfac) $_2$ -Ar계의 경우Cu(hfac) $_2$ 프리커서 자체의 열분해로부터 모든 공정조건에서 증착박막내로의 탄소 출입이 관찰되었다. Cu(hfac) $_2$ -H $_2$ ,계에서는 Cu(hfac) $_2$ -Ar계보다 낮은 온도에서 구리박막이 증착되며, H $_2$ 입력비 및 반응온도의 증가에 따라 응축상의 석출형태는 C(s)+CuF(s)로부터 C(s)+CuF(s)+Cu(s), C(s)+Cu(s), Cu(s), C(s)의 순으로 변화되는 것으로 나타났다. 【Chemical vapor deposition of copper from the Cu(hfac) $_2$ , Cu(II) hexafluoroacetylacetonate precursor, has been thermodynamically investigated by the minimization of Gibbs free energy of the system. For the Cu(hfac) $_2$ -Ar system, carbon incorporation into the deposited films was observed in all the process conditions, which is presumably inherent from the thermal decomposition of the Cu(hfac) $_2$ , precursor. For the Cu(hfac) $_2$ -H $_2$ system, lower temperatures were required than those of the Cu(hfac) $_2$ -Ar system for the depositon of the copper films. Furthermore, we identified that the appearances of the condensed phases were sequentially changed from the codeposits of C(s)+CuF(s) to C(s)+CuF(s)+Cu(s), C(s)+Cu(s), Cu(s), and C(s), when the H $_2$ input ratio and th reaction temperature were increased.】" @default.
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- W782786444 date "1995-01-01" @default.
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- W782786444 title "Thermodynamic Equilibrium Analysis of Copper Chemical Vapor Deposition from Cu(II) Hexafluoroacetylacetonate Precursor" @default.
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