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- W788477251 abstract "Abstract Gate oxide rupture is a major concern in IC failure reliability, especially as latent wafer fab defect is difficult to screen out at component testing. Failure Analysis is key in improving product quality as it allows understanding the failure root cause in order to establish manufacturing corrective actions. Three automotive components Failure Analysis cases dealing with different types of latent gate oxide defects will be presented as well as the associated correctives actions." @default.
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- W788477251 date "2015-08-01" @default.
- W788477251 modified "2023-09-28" @default.
- W788477251 title "Latent gate oxide defects case studies" @default.
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- W788477251 doi "https://doi.org/10.1016/j.microrel.2015.06.096" @default.
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