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- W789756705 abstract "Abstract The hot deformation behavior of 2060 alloy has been studied using thermal simulation test, EBSD technique and transmission electron microscopy. The flow stress could be described by a Zener-Hollomon parameter in hyperbolic sine function with the hot deformation activation energy of 205 kJ/mol. Dynamic recovery is the main dynamic soften mechanism of 2060 alloy. The relative volume fraction of subgrains increases from about 30% to 90% as the temperature rises from 350 °C to 400 °C. When the temperature is higher than 400 °C, both the relative volume fraction of the deformed grains and subgrains remain steady. The processing maps are similar in the strain ranging from 0.1 to 0.5, and the unsafe domains increase with the increase of strain. The optimum hot-working condition for 2060 alloy is 380–500 °C and 0.01–3 s−1." @default.
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- W789756705 date "2015-11-01" @default.
- W789756705 modified "2023-10-03" @default.
- W789756705 title "Hot deformation behavior of 2060 alloy" @default.
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- W789756705 doi "https://doi.org/10.1016/j.jallcom.2015.07.027" @default.
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