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- W810885440 abstract "We have demonstrated a modified fringe reflection method to compensate the warpage measurement errors caused by the height difference between optical reference mirror and wafer sample surface. We have used a linearity analysis approach to obtain the parabolic height errors for a 4-inch sapphire wafer warpage measurement, which is around 1.48 μm of 100 μm height difference. The experimental results shows the warp discrepancy of 6-inch sapphire wafer is less than 1 μm compared with the reference Tropel instrument." @default.
- W810885440 created "2016-06-24" @default.
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- W810885440 date "2015-06-22" @default.
- W810885440 modified "2023-09-23" @default.
- W810885440 title "Wafer warpage characterization measurement with modified fringe reflection method" @default.
- W810885440 cites W1969151938 @default.
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- W810885440 doi "https://doi.org/10.1117/12.2184699" @default.
- W810885440 hasPublicationYear "2015" @default.
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