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• W830742069 abstract "The demands for high density, fine pitch interconnections in electronics systems hasseen solder-based approaches for such interconnections miniaturized to the scale of tensof micro meters. At such a small scale, such 'micro joints' may contain only one or afew grains and the resultant mechanical behaviour may not be that for a polycrystallineaggregate, but rather for a single crystal. Since the ~-Sn matrix of SnAgCu solder has acontracted body-centred tetragonal (BCT) structure, such a solder grain is expected todemonstrate a considerably anisotropic behaviour. In such cases the reliability of a Phfreesolder is strongly dependent on the local microstructural features, such as the sizeand orientation of the grains. This thesis presents the investigation of the evolution ofmicrostructure within a joint or at the interface and, the influence of suchmicrostructural features on the meso-scale mechanical behaviour of the Ph-free solder.It includesEvolution of the interface between a molten solder and the Cu substrateTo form a joint, the solder alloy is heated and molten, wetting a solid under-bumpmetallization. After solidification, layers of brittle intermetallic compounds (IMCs) areformed at the interface. In this project, facilities were set up to obtain interfacialreactants at an arbitrary moment of the liquid/solid reaction. Formation and evolution~during reflow of SnCu IMCs at the interface between the molten SnAgCu alloy and theCu UBM was captured and presented for the first time.Formation of phases and IMCs with the body of a liquid SnAgCu solder duringsolidificationThe formation behaviour of basic components for a SnAgCu grain (including Sndendrites, AIDSn and Cu6Sns IMCs) during solidification was investigated.Relationships between the growth behaviour of these components and their internallattice orientation were studied. The characteristic growth and coupling of AIDSn IMCsand the Sn matrix to form eutectics has been elaborated and presented in this study for- 1-the first time. Based on the results, the forming process of a eutectic SnAgCu grainunder the non-equilibrioum solidification condition was illustrated; and major factorsthat determine the lattice-orientation, size and substructure of the grain were discussed.Meso- and Micro- scale mechanical behaviour of a SnAgCu solder jointTo study the size effect on the microstructure, and subsequently, the meso-scale ·mechanical behaviour, solder joints were manufactured with varying geometries.Shearing tests were performed·on these meso-scale joints. The results first demonstratedthat the anisotropic characteristics of a SnAgCu grain play an important role in themechanical behaviour of both a meso-scale solder joint and the adjacent interfacialIMCs. To further investigate the micro-scale deformation and damage mechanisms,micro-mechanical tests were preformed within a SnAgCu grain.Constitutive equations for a SnAgCu grainBased on the experimental results, a crystal model was established to describe thelocal microstructure-dependent mechanical behaviour. The constitutive equation wasimplemented by means of the finite element approach, and applied in solder joints of aFlip Chip (FC) package by a multi-scale method. To describe the crystal behaviour atthe higher temperature, the model was improved to account for deformations due tovacancy diffusion and thermal expansion. This model was integrated by an implicitapproach, and implemented in a full three dimension (3D) finite element (FE) model." @default.
• W830742069 created "2016-06-24" @default.
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• W830742069 date "2007-01-01" @default.
• W830742069 modified "2023-09-24" @default.
• W830742069 title "Microstructural features and mechanical behaviour of lead free solders for microelectronic packaging" @default.
• W830742069 hasPublicationYear "2007" @default.
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