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• W8462 abstract "The electronics industry aims at following Moore's law which states that the amount of transistors per unit area doubles every two years. To achieve this, the industry manufacturing Integrated Circuits (ICs) requires production technologies capable of producing smaller details. The machines capable of fulfilling these demands become more expensive and so does the cost per chip. This increase in cost is undesirable and a solution to this problem is to increase the production volumes per unit of time per machine. The industry's approach to increase the production volumes is to increase the diameter of the wafer from 300 mm to 450 mm. The increase in size of some components in the lithography machines introduces a number of challenges to the position control of the wafer chuck in lithography machines. The main challenge is the positioning accuracy requirements of the wafer chuck with respect to the focal point of the projection optics. This is caused by the decreased stiffness of the wafer chuck, which induces undesirable deformations of the wafer resulting in decreased positioning accuracy of the chuck with respect to the focal point. Recently, two new algorithms for estimating the wafer and wafer chuck deformations have been developed that may help solve this problem. The estimation algorithms rely on models to generate accurate estimates. In general the input, output, or both signals are not measurable. Therefore, it is not straight forward to apply system identification techniques to obtain a model. As alternative a model can be obtained from physical modeling. Both approaches are likely to result in a mathematical model with high uncertainties. The effect of model uncertainty on one of the estimation algorithms is studied in this thesis. The model uncertainty is propagated through the algorithm to obtain a theoretical upper bound on the estimation error. The error bounds are also used to solve the constructed Least Squares (LS) problems using Robust Least Squares (RLS) algorithms where for a case study the estimation accuracy is analyzed and compared with the estimates obtained using Ordinary Least Squares (OLS). It is concluded that the usage of RLS algorithms together with the obtained error bounds increases the estimation quality under certain conditions. Furthermore, to show that these algorithms work, experimental results are preferred over simulation results and therefore an experimental setup is designed. The setup will also be used to demonstrate the capabilities of the estimation algorithms under conditions that are topologically similar to those in a real lithography machine. Finally, the setup has been build and its performance is validated using measurements. From these measurements it is concluded that the setup's specification matches with the designed specifications." @default.
• W8462 created "2016-06-24" @default.
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• W8462 date "2014-12-09" @default.
• W8462 modified "2023-09-26" @default.
• W8462 title "Shape estimation of a compliant wafer chuck in lithography systems" @default.
• W8462 hasPublicationYear "2014" @default.
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