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- W851878372 abstract "The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K." @default.
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- W851878372 date "2007-01-01" @default.
- W851878372 modified "2023-09-26" @default.
- W851878372 title "Reliability of Sn-8Zn-3Bi Solder Paste Applied to Lead and Lead-free Plating on Lead-frame under Thermal Shock Test" @default.
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