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• W864268202 abstract "MOCVD TiN films were prepared from a new TiN precursor, tetrakis(etylmethylamino)titanium (TEMAT) and ammonia. Deposition of TiN films from a single precursor, TEMA T yielded the growth rates of /min, depending on the deposition temperature. Furthermore, the excellent bottom coverage of -90% over contacts was obtained at . The addition of ammonia to TEMA T lowered the resistivity of as- deposited TiN film to ~ from and improved the stability of TiN film in air. Examination of the films by Auger electron spectroscopy(AES) showed that the oxygen and carbon contents decreased with the addition of ammonia. However, increasing ammonia flow rate decreased the bottom coverage of TiN films over contacts, probably due to the high sticking coefficient of intermediate species produced from the gas phase reaction of TEMA T and ammonia. Based on the byproduct gases detected by the quadrupole mass spectrometer (QMS), the transammination reaction was proposed to be responsible for TiN deposition. In addition, XPS analysis revealed that the carbon in the films made from TEMA T and ammonia was metallic carbon, suggesting that -hydrogen activation process occurs competitively with the transammination reaction." @default.
• W864268202 created "2016-06-24" @default.
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• W864268202 date "1999-01-01" @default.
• W864268202 modified "2023-09-24" @default.
• W864268202 title "Formation of MOCVD TiN from a New Precursor" @default.
• W864268202 hasPublicationYear "1999" @default.
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