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- W884083309 abstract "This thesis investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated under water. Interestingly, a particular parameter combination enables a smooth surface, which can improve the surface quality of micro-machining products. This thesis first investigates the single ablation and multi-pulse ablation processes in order to study the effects of laser parameters on ablation morphology, as well as the basic physics and mechanism of the laser-material interaction process under water. Laser power, focal position, and laser pulse number are alternately varied to cause different levels of laser energy to be deposited onto the silicon surface. Interesting surface morphology phenomena, such as flower-like structures and co-central rings, are detected. Next, femtosecond laser direct writing process in water confinement is investigated. By scanning the surface at different laser repetition rates and different laser powers, a good surface quality can be achieved at a certain threshold repetition rate combined with relatively low power levels. Post-processing, such as annealing and chemical etching, also alters the surface pattern, but not as pronouncedly as changing laser parameters. The unique discovery of a smoothly processed silicon surface in water confinement under certain laser parameter combinations may help improve laser direct micro-machining surface quality in industrial applications." @default.
- W884083309 created "2016-06-24" @default.
- W884083309 creator A5041799402 @default.
- W884083309 date "2008-01-01" @default.
- W884083309 modified "2023-09-24" @default.
- W884083309 title "Femtosecond laser micro-structuring of silicon wafer in water confinement" @default.
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