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• W895188423 abstract "Abstract Power cycling is the most realistic stress test for thermo-mechanical accelerated failure mechanisms in power devices. The fast evolution in solder materials and packaging techniques makes it necessary to find the proper accelerate test conditions for any specific package/mounting solution. This paper deals with a procedure for determining the power cycling optimal parameters (power rating, period, duty-cycle, cooling conditions) for accelerated stress tests on solder joints of SMD power devices mounted on a specific board. The procedure is based on FEM numerical analysis and preliminary experimental tests. Simulation results are presented; they are validated by comparison with measurements performed using an ad-hoc experimental setup. Early power cycling is also shown." @default.
• W895188423 created "2016-06-24" @default.
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• W895188423 date "2015-08-01" @default.
• W895188423 modified "2023-09-25" @default.
• W895188423 title "Numerical analysis and experimental tests for solder joints power cycling optimization" @default.
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• W895188423 doi "https://doi.org/10.1016/j.microrel.2015.06.020" @default.
• W895188423 hasPublicationYear "2015" @default.
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