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• W93312785 abstract "This thesis has explored the possibility of using carbon nanotubes (CNT) as a novel material for through-silicon vias (TSV) in 3D-integrated circuits. With the steady downscaling trend of the semiconductor industry, a major limiting factor to the overall performance of the device is the delay from interconnects; a trend that is worsening over successive technology nodes. As a remedy to this, the industry has been exploring the possibility of fabricating three dimensional integrated circuits, with shorter interconnect lengths (hence delay). Even then, the standard interconnect (or via) material, which is copper, poses a host of physical and technological challenges that constrain the development of this technology. The carbon nanotube is considered to be a promising alternative to copper, which can alleviate most of these problems. The thesis investigated the LPCVD growth of CNT on a novel substrate, with Fe as catalyst layer and ZrN as support layer. The combination of these two materials has the potential to support the growth of ultra-long CNT vias that are ideal for TSV applications. Before the successful growth of CNT, however, the right growth recipe had to be identified. For this purpose, a design-of-experiments approach was followed and the Taguchi method was used to optimize the recipes. Using optimized recipes for the highest length, CNT growth on continuous and patterned catalyst islands were carried out, resulting in a super-growth of ~ 900 µm in the first case, and ~ 200 µm in the second. The difference in magnitude and uniformity of the growth height for the two cases was studied, and it was understood how the size and distribution of the catalyst islands played an important role in CNT growth. When fabricating CNT-based interconnects, one should also have an idea about their electrical properties. An important property is the resistivity, which needs to be lower than copper. During this work, a recipe was designed which could grow CNT with the minimum resistivity. In order to achieve this, two equivalent circuit models were studied and a simple model was developed, which could calculate the CNT resistivity from their physical parameters (quality, density, diameter etc.). To measure the values of these parameters, a series of characterization experiments were performed on the growth samples, and their resistivities were calculated. Seeing that, these values were orders of magnitude higher than copper, new recipes were designed to increase the CNT growth density and quality. Using these, it was possible to decrease the CNT resistivity. Finally, the designed recipes were put to the test, when integration of CNT as TSV was attempted in a real 3D-IC prototype. Although not entirely successful, the growth results so obtained, gave an indication of how CNT growth in deep vias could be performed, and the TSV process made successful in the future." @default.
• W93312785 created "2016-06-24" @default.
• W93312785 creator A5030851719 @default.
• W93312785 date "2014-04-10" @default.
• W93312785 modified "2023-09-23" @default.
• W93312785 title "Super-growth of CNTs based on ZrN for TSV application" @default.
• W93312785 cites W1494275336 @default.
• W93312785 cites W1555799543 @default.
• W93312785 cites W1560789367 @default.
• W93312785 cites W1646294624 @default.
• W93312785 cites W191593557 @default.
• W93312785 cites W1963591154 @default.
• W93312785 cites W1966325235 @default.
• W93312785 cites W1967169667 @default.
• W93312785 cites W1970928522 @default.
• W93312785 cites W1971625369 @default.
• W93312785 cites W1977023681 @default.
• W93312785 cites W1979682966 @default.
• W93312785 cites W1980273475 @default.
• W93312785 cites W1980538156 @default.
• W93312785 cites W1982519899 @default.
• W93312785 cites W1990769017 @default.
• W93312785 cites W1992507266 @default.
• W93312785 cites W1993352913 @default.
• W93312785 cites W1993893316 @default.
• W93312785 cites W1993993440 @default.
• W93312785 cites W2001305408 @default.
• W93312785 cites W2001532717 @default.
• W93312785 cites W2002085065 @default.
• W93312785 cites W2002877880 @default.
• W93312785 cites W2004514463 @default.
• W93312785 cites W2005413963 @default.
• W93312785 cites W2005426677 @default.
• W93312785 cites W2005635819 @default.
• W93312785 cites W2006024520 @default.
• W93312785 cites W2007737299 @default.
• W93312785 cites W2009195513 @default.
• W93312785 cites W2010711800 @default.
• W93312785 cites W2011721445 @default.
• W93312785 cites W2011763727 @default.
• W93312785 cites W2012254862 @default.
• W93312785 cites W2013239672 @default.
• W93312785 cites W2016855688 @default.
• W93312785 cites W2018566947 @default.
• W93312785 cites W2018858346 @default.
• W93312785 cites W2021216650 @default.
• W93312785 cites W2021485217 @default.
• W93312785 cites W2022232697 @default.
• W93312785 cites W2022972536 @default.
• W93312785 cites W2024507796 @default.
• W93312785 cites W2029011826 @default.
• W93312785 cites W2030535014 @default.
• W93312785 cites W2034150944 @default.
• W93312785 cites W2034695429 @default.
• W93312785 cites W2034947474 @default.
• W93312785 cites W2038125062 @default.
• W93312785 cites W2041986849 @default.
• W93312785 cites W2045231608 @default.
• W93312785 cites W2047020565 @default.
• W93312785 cites W2047928556 @default.
• W93312785 cites W2048752671 @default.
• W93312785 cites W2049420036 @default.
• W93312785 cites W2052132298 @default.
• W93312785 cites W2053836973 @default.
• W93312785 cites W2054406876 @default.
• W93312785 cites W2056239380 @default.
• W93312785 cites W2057219932 @default.
• W93312785 cites W2062849082 @default.
• W93312785 cites W2063179591 @default.
• W93312785 cites W2064663313 @default.
• W93312785 cites W2065611419 @default.
• W93312785 cites W2066713223 @default.
• W93312785 cites W2069427457 @default.
• W93312785 cites W2070237243 @default.
• W93312785 cites W2070657657 @default.
• W93312785 cites W2071003187 @default.
• W93312785 cites W2073254867 @default.
• W93312785 cites W2074583386 @default.
• W93312785 cites W2074884235 @default.
• W93312785 cites W2075258188 @default.
• W93312785 cites W2076315252 @default.
• W93312785 cites W2076767250 @default.
• W93312785 cites W2078234803 @default.
• W93312785 cites W2078833171 @default.
• W93312785 cites W2080214730 @default.
• W93312785 cites W2080451420 @default.
• W93312785 cites W2080525614 @default.
• W93312785 cites W2080734774 @default.
• W93312785 cites W2080846760 @default.
• W93312785 cites W2085816037 @default.
• W93312785 cites W2087060531 @default.
• W93312785 cites W2090216032 @default.
• W93312785 cites W2091799284 @default.
• W93312785 cites W2092100813 @default.
• W93312785 cites W2093977862 @default.
• W93312785 cites W2094076040 @default.
• W93312785 cites W2094651408 @default.
• W93312785 cites W2096851523 @default.
• W93312785 cites W2102177856 @default.
• W93312785 cites W2103820989 @default.

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