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- W933307029 abstract "研究了碳化硅晶须（ＳｉＣｗ）增强，Ｙ２Ｏ３稳定的ＺｒＯ２四方多晶体（Ｙ－ＴＺＰ）复合材料（ＳｉＣｗ／Ｙ－ＴＺＰ）在循环压应力作用下的疲劳特性，单边缺口弯曲试样在纵向循环压应力作用下缺口根部产生垂直于压应力的Ｉ型裂纹，类似于金属材料，在室温下循环应力导致Ｉ型裂纹的稳定扩展。压应力在缺口根部产生的不可逆损伤区在循环卸载过程中形成较大的残余拉伸应力场，使裂纹萌生并长大，同时，裂纹面产生的碎粒及晶须拔出导" @default.
- W933307029 created "2016-06-24" @default.
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- W933307029 date "1994-10-25" @default.
- W933307029 modified "2023-09-23" @default.
- W933307029 title "陶瓷基复合材料(SiC_W/Y—TZP)在循环压应力下的疲劳裂纹扩展" @default.
- W933307029 hasPublicationYear "1994" @default.
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