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- W93516154 abstract "Wafer-level three-dimensional (3D) integration is an emerging technology to increase theperformance and functionality of integrated circuits (ICs) and microelectromechanical systems(MEMS). In ICs, ..." @default.
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- W93516154 date "2005-01-01" @default.
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- W93516154 title "Wafer-Level 3D Integration Technology Platforms for ICs and MEMS" @default.
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