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- W94093397 abstract "SUMMARYThe development of the electronics industry shows some prevailing trends that have consequences also for surface technology eg. miniaturisation, cost reduction and environmental needs. Thus, for electroplating of connectors sufficient answers have also to be found to meet these challenges. Selective 3-D connector plating, use of electrolytic nickel-phosphorus (NiPhosConx) barrier layer instead of electrolytic nickel and SPINJEV-selective masking technique are shown to be efficient for reel-to-reel plating, especially to meet cost reduction needs." @default.
- W94093397 created "2016-06-24" @default.
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- W94093397 date "2003-01-01" @default.
- W94093397 modified "2023-09-23" @default.
- W94093397 title "New Developments in Reel-To-Reel plating of Connectors" @default.
- W94093397 doi "https://doi.org/10.1080/00202967.2003.11871498" @default.
- W94093397 hasPublicationYear "2003" @default.
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