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- W9439277 abstract "Lead free solder materials have been wildly used on printed circuit boards in electronic apparatus. The solder joints sometimes are opened under thermal cyclic loads. The fatigue crack is initiated usually around the edge of the interface where the strain concentrates severely. In this study, Sn-3.0Ag-0.5Cu test pieces with V shape notch were supplied to fatigue tests, and inelastic simulation was performed to obtain the strain distribution around the notch. The low cycle fatigue test result with or without a notch and the simulated result were compared, and discussed the prediction method for fatigue life of lead free solder joint." @default.
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- W9439277 date "2014-01-01" @default.
- W9439277 modified "2023-09-27" @default.
- W9439277 title "Fatigue life of lead free solder material with very sharp notch" @default.
- W9439277 cites W1984111738 @default.
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- W9439277 doi "https://doi.org/10.1533/9780081002254.88" @default.
- W9439277 hasPublicationYear "2014" @default.
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