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• W96356091 abstract "Sharp developed CSP (Chip Size Package or Chip scale package), a high density package with an area array terminal structure and external size nearly equal to that of an LSI chip, and commenced mass production in August 1996. IT makes the best use of conventional technologies such as wire bond, transfermold, etc., making it possible to utilize existing equipment and ensurehighproductivity. Using a polyimide substrate, wire bond and single-side transfermold are applied after LSI chip mounting on the polyimide substrate. For resistance to reflow heat, the polyimide substrate is equipped with a vent hole structure that relieves the steam siesta during reflow, thus complying with JEDEC level 2. For motherboard mounting, we evaluated board bending and falling tests after mounting, focusing not only on the temperature cycle evaluation to date but also on the mounting reliability ofportable equipment. We currently produce between one and two million packages per month for portable equipment, and production capacity is scheduled expand in the future." @default.
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• W96356091 date "1997-01-01" @default.
• W96356091 modified "2023-09-24" @default.
• W96356091 title "CSP Packaging and Mounting Technologies for Mobile Apparatus" @default.
• W96356091 hasPublicationYear "1997" @default.
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