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- W973145439 abstract "Due to their high intrinsic axial thermal conductivity, carbon nanotube (CNT) arrays have generated much interest as next generation thermal interface materials. A significant barrier in their future use is CNT-substrate thermal boundary resistance. For this reason much research has been done in examining improved array adhesion methods. This paper models the thermal resistance of a novel interface structure which shows promise in achieving low thermal resistance and high mechanical compliance. Through the use of a thermal conductive adhesive attachment, overall thermal resistances below 1 mm2 KW−1 can potentially be achieved using a vertically aligned CNT array, which will enable development of future high performance electronic packages." @default.
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- W973145439 date "2015-10-01" @default.
- W973145439 modified "2023-09-26" @default.
- W973145439 title "Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material" @default.
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- W973145439 doi "https://doi.org/10.1016/j.ijthermalsci.2015.05.006" @default.
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