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- W984957228 abstract "采用现有元器件封装技术的表面安装设计正很快接近基片(substrate,以下同)密度限制。一个可能的解决办法是使用多芯片模块(MCM)或更确切地说,是层压基片的改型,称作(MCM-L)。MCM-L技术还处于初期,它要从现有表面安装技术(SMT)中吸取优点,并突破现有技术。从设计和制造角度看,MCM-L是多层印制板(PCB)应用中元器件组装的下一个合乎逻辑的步聚。" @default.
- W984957228 created "2016-06-24" @default.
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- W984957228 date "1994-01-01" @default.
- W984957228 modified "2023-09-25" @default.
- W984957228 title "MCM—L:多层PCB的一个动态演变" @default.
- W984957228 hasPublicationYear "1994" @default.
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