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- W989623665 abstract "Publisher Summary Electronics is considered the highest technology industry. It is the most archaic in its packaging technology. The chapter helps inform those involved in this industry of the advantages of value packaging of its products. The electrostatic discharge (ESD) packaging industry has grown up to support the desires of the electronics industry. There are two dominant chemical technologies that achieve static dissipation as Type 11 electronics packaging films: as defined by EIA 541 or MIL-B-8 1705-C and as the static dissipative-heat-sealing layer of many electromagnetic interference (EMI) shielding Type I and static shielding Type III films. A recent development led to a protective packaging system that uses air channels surrounding the product to cushion and protect it and provide electrostatic shielding and moisture barrier. The system as it is conceived does away with the individual components used in the normal combination packaging of integrated circuits." @default.
- W989623665 created "2016-06-24" @default.
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- W989623665 date "1999-01-01" @default.
- W989623665 modified "2023-09-26" @default.
- W989623665 title "Electronic Packaging for the Next Century" @default.
- W989623665 doi "https://doi.org/10.1016/b978-188420777-8.50035-7" @default.
- W989623665 hasPublicationYear "1999" @default.
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